Wafer processing systems including multi-position batch load lock apparatus with temperature control capability

ABSTRACT

Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

RELATED APPLICATIONS

The present application is a divisional of, and claims priority from,U.S. Non-provisional patent application Ser. No. 14/211,123 filed Mar.14, 2014, and entitled “MULTI-POSITION BATCH LOAD LOCK APPARATUS ANDSYSTEMS AND METHODS INCLUDING SAME” (Attorney Docket No.20667-02USA/FEG/SYNX), which claims the benefit of U.S. ProvisionalPatent Application Ser. No. 61/879,076, filed Sep. 17, 2013, entitled“SUBSTRATE DEPOSITION SYSTEMS, ROBOT TRANSFER APPARATUS, AND METHODS FORELECTRONIC DEVICE MANUFACTURING” (Attorney Docket No.20666USAL03/FEG/SYNX), U.S. Provisional Patent Application Ser. No.61/868,795, filed Aug. 22, 2013, entitled “SUBSTRATE DEPOSITION SYSTEMS,ROBOT TRANSFER APPARATUS, AND METHODS FOR ELECTRONIC DEVICEMANUFACTURING” (Attorney Docket No. 20666USAL02/FEG/SYNX), U.S.Provisional Patent Application Ser. No. 61/787,117, filed Mar. 15, 2013,entitled “SUBSTRATE DEPOSITION SYSTEMS, APPARATUS AND METHODS FORELECTRONIC DEVICE MANUFACTURING” (Attorney Docket No. 20666USAL/FEG/SYNX), and U.S. Provisional Patent Application Ser. No.61/800,595, filed Mar. 15, 2013, entitled “WAFER HANDLING SYSTEMS ANDMETHODS FOR SMALL BATCHES OF WAFERS” (Attorney Docket No.20667L/FEG/SYNX). All of the above-listed patent applications are herebyincorporated herein by reference in their entirety for all purposes.

FIELD

Embodiments of the invention relate to semiconductor devicemanufacturing, and more particularly to substrate processing systems andmethods including batch load lock apparatus.

BACKGROUND

Within a semiconductor device manufacturing process, a wafer handlingsystem may move wafers into and out of various process chambers toundergo processing. Some chambers may process simultaneously smallbatches of wafers (e.g., about six wafers), such as in a carouselprocessing system. Some known wafer handling systems may be capable oftransferring wafers through a manufacturing process at a relatively highthroughput, but may only transfer wafers one at a time.

Accordingly, improved wafer handling systems and methods capable oftransferring small batches of wafers into and out of various chambersare sought.

SUMMARY

In a first aspect, a wafer processing system is provided. The waferprocessing system includes a transfer chamber, one or more processingchambers coupled to the transfer chamber, a batch load lock apparatuscoupled to the transfer chamber, the batch load lock apparatus includingmultiple wafer stations, and a robot within the transfer chamber andconfigured to transfer wafers between the one or more processingchambers and the batch load lock apparatus, wherein the batch load lockapparatus includes temperature control capability.

In another aspect, a wafer processing system is provided. The waferprocessing system includes a transfer chamber, one or more processingchambers coupled to the transfer chamber, the one or more processingchambers included in one or more carousels, a first batch load lockapparatus coupled to the transfer chamber, the first batch load lockapparatus including multiple wafer stations and temperature controlcapability, a second batch load lock apparatus coupled to the transferchamber, the second batch load lock apparatus including multiple waferstations and temperature control capability, a robot within the transferchamber and configured to transfer wafers between the one or moreprocessing chambers and the first batch load lock apparatus and thesecond batch load lock apparatus, and a mainframe body including a firstwall, a second wall, a third wall, and a fourth wall, the first batchload lock apparatus coupled to the first wall of the mainframe body, afirst carousel of the one or more carousels coupled to the third wall ofthe mainframe body opposite the first batch load lock, the second batchload lock apparatus coupled to the second wall of the mainframe body,and a second carousel of the one or more carousels coupled to the fourthwall of the mainframe body opposite the second batch load lock.

In another aspect, a wafer processing system is provided. The waferprocessing system includes a transfer chamber, one or more processingchambers coupled to the transfer chamber, a batch load lock apparatuscoupled to the transfer chamber, the batch load lock apparatus includingmultiple wafer stations and temperature control capability, a robotwithin the transfer chamber and configured to transfer wafers betweenthe one or more processing chambers and the batch load lock apparatus,and a mainframe body including a first wall, a second wall, a thirdwall, and a fourth wall, a first processing chamber of the one or moreprocessing chambers coupled to the first wall, a second processingchamber of the one or more processing chambers coupled to the secondwall, a third processing chamber of the one or more processing chamberscoupled to the third wall, and the batch load lock apparatus coupled tothe fourth wall.

Other features and aspects of the invention will become more fullyapparent from the following detailed description of example embodiments,the appended claims, and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a wafer processing system including a batch load lockapparatus according to embodiments.

FIG. 2 illustrates another wafer processing system including a batchload lock apparatus according to embodiments.

FIG. 3 illustrates another wafer processing system including multiplebatch load lock apparatus according to embodiments.

FIG. 4 illustrates another wafer processing system including two batchload lock apparatus according to embodiments.

FIG. 5A illustrates a cross-sectional side view of a batch load lockapparatus with temperature control capability according to embodiments.

FIG. 5B illustrates another cross-sectional side view of a batch loadlock apparatus with temperature control capability according toembodiments.

FIG. 5C illustrates a cross-sectioned top view of a batch load lockapparatus with temperature control capability according to embodiments.

FIG. 5D illustrates a side plan view of a portion of a lift assembly ofa batch load lock apparatus according to embodiments (shown in isolationwith other components removed for clarity).

FIG. 5E illustrates a side plan view of a portion of a lift assembly ofa batch load lock apparatus according to embodiments (shown in isolationwith other components removed for clarity).

FIG. 6 illustrates a side plan view of a portion of an alternate liftassembly of a batch load lock apparatus according to embodiments (shownin isolation with other components removed for clarity).

FIG. 7 illustrates another batch load lock apparatus with or withouttemperature control according to embodiments.

FIG. 8 illustrates a flowchart of a method of operating a batch loadlock apparatus according to embodiments.

DETAILED DESCRIPTION

Embodiments described herein relate to semiconductor processing systems,and wafer handling apparatus and methods including batch load lockapparatus configured and adapted to transfer small batches of wafers(e.g., 5 or 6 wafers). In some embodiments, temperature controlcapability is provided by the batch load lock apparatus. Transfer by thewafer handling system may be into or out of one or more processingchambers in a semiconductor processing system. In some embodiments, thewafer processing chambers may be capable of processing small batches ofwafers simultaneously, such as in carousel wafer processing systems.

The wafer handling apparatus, batch load lock apparatus may have arelatively small footprint and may maintain about the same or improvedwafer throughput as compared to known wafer handling systems and methodscapable of transferring only one wafer at a time. Embodiments of waferhandling apparatus and batch load lock apparatus as described herein maybe applicable to transferring wafers from ALD (atomic layer deposition)carousels or other process chambers to a factory interface, and viceversa.

In accordance with one or more embodiments, an improved load lockapparatus is provided capable of transferring a batch of wafers. Thebatch load lock apparatus described herein provides the capability ofloading and unloading a wafer processing system in a simple andeffective manner. The batch load lock apparatus may interface with afactory interface that is configured and adapted to transfer wafersbetween the batch load lock and wafer carriers docked to the factoryinterface.

Further examples and description of the various embodiments of theinvention are described with reference to FIGS. 1-8 herein.

Referring now to FIG. 1, a first embodiment of a wafer processing system100 is shown. Wafer processing system 100 includes a transfer chamber102, one or more processing chambers 104 (a few labeled) that areaccessed from the transfer chamber 102, a batch load lock apparatus 106coupled to the transfer chamber 102, and a robot 108 within the transferchamber 102 and configured to transfer wafers 110 between the one ormore processing chambers 104 and the batch load lock apparatus 106. Inthe depicted embodiment, the batch load lock apparatus 106 includesmultiple wafer stations, which may be stacked vertically.

The batch load lock apparatus may include wafer temperature controlcapability. For example, one or more of the multiple wafer stations mayinclude temperature control capability. Temperature control capabilitymay include active heating, active cooling, or both. Some or all of thestations in the batch load lock apparatus 106 may include heatingcooling or both, as will be described further herein. Other means foraccomplishing heating and cooling of the wafer batch are described.Accordingly, in some embodiments, the batch load lock apparatus 106 mayinclude the ability to preheat wafers 110 prior to transferring them tothe processing chambers 104 on the robot 108. In other embodiments, thebatch load lock apparatus 106 may include the ability to cool the wafers110 after returning from the processing chambers 104 and beingtransferred back to the factory interface 120.

In more detail, the transfer chamber 102 may be formed by walls of amainframe structure 103. One or more of the walls may be removable toprovide service access. The robot 108 within the transfer chamber 102may include any suitable structure configured and adapted to transferwafers 110 between the one or more processing chambers 104 and the batchload lock apparatus 106. The robot 108 may be any suitable multi-axisrobot apparatus as described in U.S. Pat. Nos. 5,789,878; 5,879,127;6,267,549; 6,379,095; 6,582,175; and 6,722,834; and US Pat. Pubs.2010/0178147; 2013/0039726; 2013/0149076; 2013/0115028; and2010/0178146, for example.

The robot 108 may be housed, at least partially or fully, within thetransfer chamber 102. The robot 108 may be configured and adapted toplace or extract wafers 110 (e.g., patterned or unpatterned substrates)to and from the batch load lock apparatus 106 and one or more processchambers 104. In some embodiments, the transfer chamber 102 may beoperated under a vacuum, for example, and the robot 108 may be a vacuumrobot.

In the depicted embodiment, the one or more process chambers 104 may beincluded in a carousel 112, such as the atomic layer deposition carouselshown. Carousel 112 may have carousel body 114 having a carousel chamber115 formed therein, and a carousel platform 116 rotatable within thecarousel chamber 115 and having multiple wafer placement locations(shown as dotted circles). For example, the carousel platform 116 mayinclude three, four, five, six, or even more wafer placement locations.Other numbers of wafer placement locations may be used. Each waferplacement location may be deemed a process chamber 104, where adifferent process may be taking place simultaneously at two or more ofthe wafer placement locations. In some embodiments, heating may takeplace at one wafer placement location, while another wafer placementlocation may be undergoing a deposition process. Process chamber 104 maybe separated by close-tolerance walls, various gas separators, or thelike. Other processes may take place at the process chambers 104.

The carousel 112 may include one or more process chambers 104 therein,that are coupled to the transfer chamber 102 via an opening 118. Processchambers 104 within the carousel 112 may be adapted to carry out anynumber of process steps, such as atomic layer deposition (ALD) or thelike on the wafers 110. Other processes may also be carried out therein.Access by the robot 108 to load and unload the wafers 110, before andafter processing, is through opening 118, as the respective wafers 110on the wafer placement locations are aligned with the opening 118.Processes are carried out as the wafers 110 are rotated about on thewafer placement locations of the carousel platform 116. Wafer processingcarousels are well known and will not be further described herein.

The batch load lock apparatus 106 may be coupled, as shown, to thetransfer chamber 102 opposite from the opening 118. Other orientationsof the opening 118 and batch load lock apparatus 106 may be used. Batchload lock apparatus 106, in one or more embodiments, may includemultiple wafer stations (e.g., 536A-536G) as will be described withreference to at least FIGS. 5A-5E and 6 herein.

The carousel 112 and the batch load lock 106 may include slit valves attheir ingress/egress, which may be configured and adapted to open andclose when placing or extracting wafers 110 to and from the variouschambers thereof. Slit valves may be of any suitable conventionalconstruction, such as L-motion slit valves. In some embodiments, theslit valves at the opening to the batch load lock apparatus 106 from thetransfer chamber may be double height to enable the different height endeffectors to readily access several stations of the batch load lockapparatus without a vertical height change of the robot 108, such aswhen a dual end effector robot is used as the robot 108. Similarly,batch load lock apparatus 106 may include a double- or triple-, or more,sized opening to allow loading and unloading of multiple wafers 110 toand from the factory interface 120.

Batch load lock apparatus 106 may be coupled between the mainframestructure 103 and the factory interface body 119 of the factoryinterface 120. Factory interface 120 may include a factory interfacechamber 121 adapted to receive one or more wafers 110 from wafercarriers 122 docked at load ports 124 of the factory interface 120.Wafers 110 may be transferred by a factory interface robot 125 housedwithin the factory interface chamber 121 of the factory interface 120,and the transfer may take place in any sequence or direction. Factoryinterface robot 125 in the factory interface 120 may be entirelyconventional, except that it may include multiple stacked end effectorsenabling multiple wafers 110 to be transferred at once. Wafers 110, asused herein, means articles used to make electronic devices or circuitcomponents, such as silica-containing wafers, glass discs, masks, or thelike, whether patterned or unpatterned.

Now referring to FIGS. 5A-5E, batch load lock apparatus 106 may includea load lock body 530 having walls forming a load lock chamber 532therein. The depicted embodiment of the batch load lock apparatus 106includes temperature control capability. In particular, the batch loadlock apparatus 106 includes wafer temperature control capability withinthe load lock chamber 532.

In more detail, batch load lock apparatus 106 includes a lift assembly534 positioned within the load lock body 530, the lift assembly 534including multiple wafer stations (e.g., wafer stations 536A-536G). Eachwafer station 536A-536G is configured and adapted to provide access towafers 110 by the robots 108, 125 through first and second load lockopenings 538A, 538B. Wafer station 536A-536G may be spaced at equalvertical intervals, such as a pitch of between about 25 mm and about 40mm, for example.

As shown, lift assembly 534 includes seven wafer stations 536A-536G.However, any suitable number of wafer station 536A-536G may be provided,such as 3, 4, 5, 6, 7 or more.

Lift assembly 534 may include temperature control capability, such as byincluding capability adapted to move wafers 110 towards and away fromthe multiple temperature control platforms 554 (best shown in FIG. 5E).As shown, end effectors 108E, 125E of robots 108, 125 are adapted toaccept wafers from, and deliver multiple wafers to, first and secondload lock openings 538A, 538B.

Lift assembly 534 may include a support stack 540 and temperaturecontrol stack 542, which may be moveable (e.g., vertically) relative toone another. The support stack 540 includes multiple wafer supports 544(a few labeled) that may be stacked vertically, each being adapted tosupport a wafer 110, as best shown in isolation in FIG. 5D (severaldotted wafers 110 shown). The multiple wafer supports 544 may beattached to support members 545, which may be attached to a stack riser546 at various spaced vertical locations. Stack riser 546 and supportmembers 545 may be made integral in some embodiments.

Motion of the lift assembly 534 may be accomplished by action of aprimary actuator 548 via control signal from motion controller 550.Motion controller 550 may be any suitable controller including processorand memory and other suitable electronics able to carry out motioncontrol programs. Motion controller 550 may interface with othercontrollers, such as temperature controller 568, to be further describedherein, and processing controller (not shown) for the system 100.

Primary actuator 548 is operable to raise and lower a base 547, and thesupport stack 540 and temperature control stack 542 including multipletemperature control platforms 554 that are coupled to the base 547. Thisprimary vertical motion is adapted to move desired wafer stations (oneor more stations 536A-536G) into vertical alignment with the respectiveopenings 538A, 538B to allow exchange of wafers 110 therefrom.

Additionally, the support stack 540 may be moveably coupled to the base547 and secondarily moveable (e.g., vertically) relative to a base 547of the lift assembly 534. Motion of the support stack 540 relative tothe base 547 may be produced by a secondary actuator 549, which may becoupled to the underside of the base 547, for example. Actuator rod 549Rof the secondary actuator couples to the stack riser 546 and its motioncauses motion of the stack riser 546.

In the depicted embodiment, the batch load lock apparatus 106 includes atemperature control stack 542, as best shown in FIG. 5E (shown inisolation with the other items not shown). The temperature control stack542 includes multiple temperature control platforms 554 within the liftassembly 534 including temperature control capability, i.e., the abilityto control temperature of the wafers 110. In particular, depending uponthe embodiment, the temperature control stack 542 may include eitherof: 1) active heating capability, or 2) active cooling capability, to bemore fully described herein. Wafers 110 may be brought into thermalcontact (e.g., very close proximity or in actual physical contact) withthe respective temperature control platforms 554.

Thus, in one embodiment, for example, wafers 110 may be pre-heatedbefore being transferred into the transfer chamber 102 by being broughtinto thermal contact with the respective temperature control platforms554 of the temperature control stack 542. Wafers 110 may be activelypre-heated, for example, to a temperature of between about 200° C. andabout 450° C. by the temperature control platforms 554 before movinginto the transfer chamber 102 by robot (e.g., robot 108 of FIG. 1).

In the depicted embodiment, the temperature control stack 542 includesthe multiple temperature control platforms 554 that are coupled to adistributor riser 556. In the depicted embodiment, the respectivetemperature control platforms 554 are shown coupled (e.g., attached) tothe distributor riser 556 at spaced (e.g., evenly spaced) verticallocations. Attachment to the distributor riser 556 may be by suitablefasteners (e.g., bolts or screws or the like). Each of the temperaturecontrol platforms 554 may include active thermal imparting capability,i.e., the ability to heat or cool the wafers in thermal contacttherewith.

For example, in the illustrated embodiment of FIG. 5E, resistive heatingmay be employed, wherein an arrangement of one or more resistive heatingelements 558 are provided in, or on, at least some of the temperaturecontrol platforms 554. For example, the resistive heating elements 558may traverse through channels or grooves that may be formed in or onconducting plates 560 of the temperature control platforms 554.Temperature control platforms 554 may include insulating plates 562 onan underside thereof. Conducting plates 560 may be made of a conductivematerial having a relatively high thermal conduction coefficient, suchas aluminum.

Conduits 564 (e.g., electrical conduits) may supply electrical power tothe resistive heating elements 558. The conduits 564 may be configuredto pass through one or more channels in the distributor riser 556 or beotherwise appropriately routed. Conduits 564 connect to, and providepower from, a temperature sub-unit 565, such as a heater driving unit.Conduits 564, as well as the control lines to the secondary actuator549, may pass through a wall of the load lock body 530 via one or moresealed connectors 567.

Temperature sub-unit 565 may provide heating power between about 500 Wand 3,000 W, for example. The power supplied to the resistive heatingelements 558 may be controlled via control signals from the temperaturecontroller 568. Temperature controller 568 may include suitable processand memory to carry out temperature control programs. Control of therespective temperature control platforms 554 may be individually,globally or zonally controlled for temperature to attempt to providesubstantially the same temperature exposure to the various wafers 110.Some or all of the respective temperature control platforms 554 mayinclude temperature control capability. However, one or more of theplatforms may be devoid of temperature control, i.e., they may beuncontrolled platforms 570 may be used for storage or dummy orcalibration wafer 110A.

In another embodiment, as shown in FIG. 6, the temperature controlplatforms 654 of the temperature control stack 652 may be configured toinclude hydraulic heating or cooling, and may be used instead of thetemperature control stack 542 described above in the batch load lockapparatus 106. In this embodiment, an arrangement of fluid passages 672may be provided in at least some of the temperature control platforms654. Heated or cooled thermal fluid (e.g., water, glycol, orcombinations thereof) may be passed through the fluid passages 672.There may be an inflow and outflow for each of the temperature controlplatforms 654. Fluid passages 672 may be made by cross drilling andplugging, for example. Other means for forming the fluid passages 672may be used.

Fluid flow may be supplied by conduits 664 (e.g., fluid channels).Conduits 664 in this embodiment may comprise multiple channels formed inthe distributor riser 656 that provide fluid to, and return fluid from,the respective temperature control platforms 654. Interfaces between thedistributor riser 656 and the various platforms 654 may be sealed, suchas with o-rings. Separate conduits 664 may be piped to each of thetemperature control platforms 654 to allow individual temperaturecontrol, and enable heating (or cooling) each wafer 110 to a commontarget temperature or temperature range.

Temperature control platforms 654, as before, may comprise conductingplates 660. An insulating member 662, such as a layer or plate ofinsulation, may be provided on an underside thereof. Conducting plates660 may be made of a conductive material having a relatively highthermal conduction coefficient, such as aluminum. Conduits 664 passingthrough the load lock chamber 532 may be braided fluid-carrying lines orhoses. Conduits 664 connect to, and provide heated or cooled fluid from,the temperature sub-unit 665, which may be a fluid heating and/orcooling unit. Conduits 664 may pass through a wall of the load lock body530 via one or more sealed connectors 667, in the same manner aspreviously described.

Temperature sub-unit 665 may function to supply heated fluid to heat thetemperature control platforms 654, and thus the wafers 110 in the loadlock chamber 532, to a desired temperature of between about 200° C. and450° C., for example. This may be performed as a batch, prior to thebatch being provided to the transfer chamber 102.

In other embodiments, temperature sub-unit 665 may function to cool thetemperature control platforms 654 in the load lock chamber 532 to adesired temperature of less than about 70° C., or between about 70° C.and 40° C., for example, by provide a cooling fluid to the temperaturecontrol platforms 654 through the conduits 664.

In each case, the temperature of the fluid supplied to the temperaturecontrol platforms 654 may be controlled via control signals from atemperature controller 668. As before, some or all of the respectivetemperature control platforms 654 may include temperature controlcapability. However, one or more of the platforms may be devoid oftemperature control, i.e., may be an uncontrolled platform 670 that maybe used for storage or other purposes.

In each embodiment described herein, one or more sensors may be providedon, or proximate to, the temperature control platforms 554, 654 toprovide temperature feedback to the temperature controller 568, 668.Temperature may be globally controlled, or individually controlled,zonally controlled, or any combination thereof.

It should now be apparent that embodiments of the batch load lockapparatus 106 herein allow the wafers 110 to be heated upon going intothe transfer chamber or process chamber. Furthermore, in someembodiments, the wafers 110 may be cooled on the way out of the transferchamber 102. Optionally, heating may be provided in the batch load lockapparatus 106 on wafers 110 going in for processing, and cooldownstations may be provided within the factory interface 120 (otherwisereferred to as an Equipment Front End Module (EFEM)) as the wafers 110come out after processing.

Again referring to FIG. 1, in some embodiments, a number of the waferstations in the batch load lock apparatus 106 may be greater than orequal to a number of wafers 110 comprising a batch in the processingchambers 104. For example, a batch in the depicted embodiment of FIG. 1is six wafers, i.e., equal to the number of stations on the carouselplatform 116 of the carousel 112. The batch load lock apparatus 106 mayinclude multiple wafer receiving stations, such as three or more, fouror more, five or more, or six or more wafer stations 536A-536G. Some orall the wafer stations 536A-536G may include heating or coolingcapability.

In the embodiment of wafer processing system 200 shown in FIG. 2, forexample, a batch is three wafers (e.g., one in each of process chambers204A, 204B, and 204C). Thus, the batch load lock apparatus 106, which isthe same as described above, may have three or more wafer stationstherein. In some embodiments, a multiple of a number of wafers in thebatch may be used, such as 2×, 3×, or the like. For example, if thewafer processing system 200 includes three wafers 110, then the batchload lock apparatus 106 may have 6 wafer stations therein (for 2×), ormay have 9 wafer stations therein (for 3×). Other than the differentconfiguration for the process chambers 204A-204C and transfer chamber202, as compared to FIG. 1, all the other components for the FIG. 2embodiment are as described in FIG. 1. In the embodiment of FIG. 2, thebatch load lock apparatus 106 may have the configuration shown in FIGS.5A-5E or optionally include the temperature control stack 652 of FIG. 6,and may include active heating, active cooling on some or all the waferstations therein.

FIG. 3 illustrates another wafer processing system 300, for example. Inthis wafer processing system 300, a batch is three wafers (e.g., one ineach of process chambers 204A, 204B, and 204C). However, a larger numberof process chambers may be included, by adding additional coupledmainframes, adding more processing chambers per side (e.g., twinnedchambers), and the like. In this embodiment, multiple batch load lockapparatus 106H and 106C are provided. One batch load lock apparatus 106Hmay include heating therein. The other batch load lock apparatus 106Cmay include cooling therein. Otherwise, the structure is the same asbatch load lock apparatus 106 described herein.

Some or all of the multiple wafer stations in batch load lock apparatus106H may include heating. Some or all of the multiple wafer stations inbatch load lock apparatus 106C may include cooling. In some embodiments,a multiple of the number of wafers in the batch may be used, such as 1×,2×, 3×, or the like, in one or both of the batch load lock apparatus106C, 106H. For example, if the wafer processing system 300 includes abatch of three wafers (as shown), then each batch load lock apparatus106C, 106H may include 3 wafer stations therein (for 1×), may include 6wafer stations therein (for 2×), or may have 9 wafer stations therein(for 3×). Other than the different configuration for the processchambers 204A-204C, as compared to FIG. 1, and the use of multiple batchload lock apparatus 106H, 106C, all the other components for the FIG. 3embodiment are as described in FIG. 1 and FIG. 2. In the embodimentshown in FIG. 3, the batch load lock apparatus 106H may have theconfiguration shown in FIGS. 5A-5E or include the temperature controlstack shown in FIG. 6, and may include active heating. The batch loadlock apparatus 106C may have the configuration shown in FIG. 6, forexample, and may include active cooling. Active heating and cooling maybe provided on some or all the wafer stations in each of the batch loadlock apparatus 106H, 106C.

FIG. 4 illustrates another wafer processing system 400. In this waferprocessing system 400, a batch is six wafers (e.g., one in each stationof the carousels 412A, 412B). One carousel 412A or 412B is unloaded asthe other is processing. In this embodiment, multiple batch load lockapparatus 106A, 106B are provided. Batch load lock apparatus 106A, 106Bmay be the same as batch load lock apparatus 106 described herein.Suitable spacers 407 may be used to adapt the batch load lock apparatus106A, 106B to the factory interface 120 and the transfer chamber 402 asshown.

In this FIG. 4 embodiment, the first batch load lock apparatus 106A mayoperate in conjunction with first carousel 412A located opposite acrossthe transfer chamber 402 therefrom. Second batch load lock apparatus106B may operate in conjunction with carousel 412B located oppositeacross the transfer chamber 402 therefrom. As such, robot 408, which isdescribed in U.S. Provisional Application 61/879,076 filed Sep. 17,2013, and which is incorporated by reference herein it its entirety forall purposes, may exchange wafers between the first batch load lockapparatus 106A and the first carousel 412A, as the second carousel 412Bis processing. When the second carousel 412B is finished processing, therobot 408 may exchange wafers between the second batch load lockapparatus 106B and the second carousel 412B, while the first carouselmay undergo processing.

FIG. 7 illustrates another embodiment of batch load lock apparatus 706.This embodiment includes a support stack 740 that is coupled to a base547, and moveable via the action of a primary actuator 548, via controlsignals from a motion controller 750. The lift assembly 734 may be movedto align the desired wafer stations 736A-736F with the respective loadlock openings 538A, 538B to load and unload wafers 110.

In one embodiment, no heating or cooling may be provided. In anotherembodiment, heated or cooled gas (e.g., N₂ gas) may be introduced intothe load lock chamber 532 from the temperature sub-unit 765 ascontrolled by the temperature controller 768 to heat or cool the wafers110 in the load lock chamber 532. Gas flow may be over and around thewafers 110 and may be pass-through only, i.e., exiting through anexhaust (not shown), or may be recirculating back through thetemperature sub-unit 765 in some embodiments. A vacuum may be drawn asstated herein after suitable heating of the wafers. Cooling may beaccomplished after the vacuum is removed, for example, by introducing acooling gas (cooled N₂ gas), for example.

FIG. 8 illustrates a method 800 of operating a load lock apparatus, suchas the batch load lock apparatus 106. The method 800 includes, in 802,providing a batch load lock apparatus (e.g., batch load lock apparatus106) including a load lock body (e.g., load lock body 530) with firstand second load lock openings (e.g., first and second load lock openings538A, 538B), a lift assembly (e.g., lift assembly 534) within the loadlock body including multiple wafer stations (e.g., wafer stations536A-536G). Some or all of wafer stations 536A-536G may includetemperature control platforms (e.g., temperature control platforms 554).

The method 800 includes, in 804, moving the lift assembly (e.g., liftassembly 534, 634, 734). The moving may be accomplished by moving thebase (e.g., base 547) of the lift assembly (e.g., lift assembly 534,634, 734) through action of a primary actuator (e.g., primary actuator548—See FIGS. 5A-5E, 6 and 7), which simultaneously moves the variouswafer stations (e.g., wafer stations 536A-536G, 736A-736F) to a desiredvertical location. This movement aligns one or more of the desired waferstations (e.g., one or more of wafer stations 536A-536G, 736A-736F) withone of the load lock openings (e.g., load lock opening 538A, 538B) sothat wafers 110 may be transferred into or out of the respective one ormore wafer stations (e.g., wafer stations 536A-536G, 736A-736F).

As shown in FIGS. 5B-5C, wafers 110 may be transferred into and out ofthe batch load lock apparatus 106 from the factory interface chamber 121singly or simultaneously in groups of two, three, or four, or even morewafers 110, for example. In the depicted embodiment, the wafers 110 maybe simultaneously loaded or unloaded (two optional end effectors 125E2,125E3 are shown) to or from the wafer stations (in this case 536B, 536C,and 536D—if three wafers are transferred at once). The lift assembly 534may be moved again until all the wafer stations (536A-536G) are loadedor emptied. Loading may take place from the bottom to top.

While the batch load lock apparatus 106 is being loaded from the factoryinterface chamber 121, the slit valve door 574A on the side of thetransfer chamber 102 may be closed and sealed, such that processing maytake place in the process chambers (e.g., in carousels 112—FIG. 1, inprocess chambers 204A-204C—FIGS. 2 and 3, or one of carousels 412A,412B—FIG. 4), and the slit valve door 574B may be open. When the batchload lock apparatus 106 is being loaded from the transfer chamber 102,the slit valve door 574B may be closed and sealed, and the slit valvedoor 574A may be open. Thus, as described above, the method 800includes, in 806, receiving wafers (e.g., wafers 110) on the supportstack (e.g., support stack 540, 740) at the multiple wafer stations(e.g., wafer stations 536A-536G, or 736A-736F) within the lift assembly(e.g., lift assembly 534, 734) through one of the first and second loadlock openings (first and second load lock openings 538A, 538B).

The method 800 may include, in 808, changing temperature of the wafers110 in the load lock chamber (e.g., load lock chamber 532). The changein temperature may be by way of thermal contact with the temperaturecontrol platforms (e.g., temperature control platforms 554, 654) orotherwise actively heating or cooling the wafers 110, such as describedin FIG. 7. In the embodiments described in FIGS. 5A-6, multiple wafers110 may be heated by bringing them into thermal contact with thetemperature control platforms 554. In other embodiments, the wafers 110may be cooled by bringing them into thermal contact with the temperaturecontrol platforms 654.

In embodiments where each wafer 110 is to be heated or cooled, thesupport stack 540 of the lift assembly 534, 634, after being loaded, maybe relatively moved into close proximity to, i.e., into thermal contactwith, the temperature control platforms 554, 654. Thermal contact may bein direct physical contact with, or close proximity to, in order toallow substantial change in temperature. This may be accomplished bymoving the support stack 540 via the action of the secondary actuator549 to cause relative movement between the support stack 540 and thetemperature control stack 542, 652.

Example of Operation

The following is an example of the operation of the batch load lockapparatus 106. The example method includes, opening a first slit valvedoor, 574A or 574B, moving the support stack 540 of the lift assembly534 to align wafers stations with one of the first and second load lockopenings (538A or 538B depending on whether loading from factoryinterface chamber 121 or the transfer chamber 102), and loading wafers110 into the support stack 540. One or more than one move of the liftassembly 543 may be used to load the desired number of wafers 110therein. Next, the support stack 540 may be moved relative to thetemperature control platforms 554 or 654 of the temperature controlstack 542 to bring the wafers 110 into thermal contact with thetemperature control platforms 554 or 654. The wafers 110 are then heatedor cooled to the desired temperature. Heating and cooling time andtemperature will depend on the allowed time and capability of thetemperature control stack 542, 642. Changes in temperature of the wafers110 of 100° C., or even up to 300° C. or more, may be achieved. Oncesufficiently heated or cooled, the support stack 540 may be movedrelative to the temperature control platforms 554 to separate the wafers110 from the temperature control platforms 554. The second slit valvedoor may be opened, and the wafers 110 may be unloaded. In the case ofheating, the second slit valve door may be the slit valve door to thetransfer chamber, and the wafers may be moved into the respectiveprocess chambers (e.g., 104, 104A-104C) for processing. In the case ofcooling, the wafers may be cooled on reentering the factory interface120 and be ready for loading directly into wafer carriers 122.

Wafers should be unloaded/loaded in the order of top to bottom or bottomto top, in order to prevent processed wafers from being aboveunprocessed wafers. For a wafer exchange from the factory interfacechamber 121, the exchange should take place top to bottom, thusexchanging the processed wafers first. In the case of exchange from theside of the transfer chamber 102, exchange should be bottom to top.

A complete example of an exchange from the batch load lock apparatus 106starting with a processed batch in the batch load lock apparatus 106,which has had cooling completed thereon, is as follows:

1) Open slit valve door 538B on side of factory interface 120;2) Move load/unload robot 125 into batch load lock apparatus to removewafers 110 that have been processed from the lower wafer stations (e.g.,536B, 536C, and 536D) of the lift assembly 534;3) Move wafers 110 that have been processed with load/unload robot 125from batch load lock apparatus 106 to a buffer station (not shown);4) Move wafers 110 to be processed with load/unload robot 125 frombuffer station to batch load lock apparatus 106;5) Index the lift assembly 534;

6) Repeat 3) and 4);

7) Close slit valve door 538B;8) Pump to desired vacuum level with vacuum pump 575 (e.g., via singleor dual stage evacuation to 20 Torr or higher vacuum);9) Open slit valve door 574A;10) Extend robot 108 into batch load lock apparatus 106;11) Remove wafer 110 with robot 108 and transfer to processing chamber(e.g., 104, 104A-C);12) Reload wafer 110 that has been processed into batch load lockapparatus 106;13) Continue 11) and 12) until the batch load lock apparatus 106 is fullas desired (the exchange may occur from bottom to top);14) Close slit valve door 574A; and15) Cool wafers.

Wafers may be cooled as previously described, by bringing the wafers 110into thermal contact with the temperature control platforms 554. Coolingmay be active, i.e., withdrawing heat at a rate faster than capablethrough a passive heat sink.

Accordingly, while the invention has been disclosed in connection withexample embodiments thereof, it should be understood that otherembodiments may fall within the scope of the invention, as defined bythe following claims.

The invention claimed is:
 1. A wafer processing system, comprising: atransfer chamber; one or more processing chambers coupled to thetransfer chamber; a batch load lock apparatus coupled to the transferchamber, the batch load lock apparatus including multiple waferstations; and a robot within the transfer chamber and configured totransfer wafers between the one or more processing chambers and thebatch load lock apparatus, wherein the batch load lock apparatusincludes temperature control capability.
 2. The wafer processing systemof claim 1, wherein a number of the wafer stations in the batch loadlock apparatus is greater than or equal to a number of wafers comprisinga batch in the one or more processing chambers.
 3. The wafer processingsystem of claim 1, wherein the batch load lock apparatus comprisesactive heating of one or more of the multiple wafer stations.
 4. Thewafer processing system of claim 1, wherein the batch load lockapparatus comprises active cooling of one or more of the multiple waferstations.
 5. The wafer processing system of claim 1, wherein the one ormore processing chambers are included in one or more carousels.
 6. Thewafer processing system of claim 5, wherein the one or more carouselscomprises three, four, five, six, or more wafer placement locations. 7.The wafer processing system of claim 5, wherein the one or morecarousels comprise a first carousel coupled to a mainframe and a secondcarousel coupled to the mainframe.
 8. The wafer processing system ofclaim 1, comprising the batch load lock apparatus and an additionalbatch load lock apparatus.
 9. The wafer processing system of claim 1,comprising the batch load lock configured to operate in conjunction witha first carousel located opposite across the transfer chamber.
 10. Thewafer processing system of claim 9, comprising a second batch load lockconfigured to operate in conjunction with a second carousel locatedopposite across the transfer chamber.
 11. The wafer processing system ofclaim 1, wherein the batch load lock apparatus is coupled between amainframe body and a factory interface body of a factory interface. 12.The wafer processing system of claim 11, wherein the factory interfacecomprises a factory interface chamber adapted to receive one or morewafers from one or more wafer carriers docked at one or more load portsof the factory interface.
 13. The wafer processing system of claim 12,wherein the factory interface chamber comprises a factory interfacerobot.
 14. The wafer processing system of claim 13, wherein the factoryinterface robot includes multiple stacked end effectors configured totransfer multiple wafers at once.
 15. The wafer processing system ofclaim 1, comprising an additional batch load lock apparatus coupled tothe transfer chamber, the additional batch load lock apparatus includingmultiple wafer stations and temperature control capability.
 16. A waferprocessing system, comprising: a transfer chamber; one or moreprocessing chambers coupled to the transfer chamber, the one or moreprocessing chambers included in one or more carousels; a first batchload lock apparatus coupled to the transfer chamber, the first batchload lock apparatus including multiple wafer stations and temperaturecontrol capability; a second batch load lock apparatus coupled to thetransfer chamber, the second batch load lock apparatus includingmultiple wafer stations and temperature control capability; a robotwithin the transfer chamber and configured to transfer wafers betweenthe one or more processing chambers and the first batch load lockapparatus and the second batch load lock apparatus; and a mainframe bodyincluding a first wall, a second wall, a third wall, and a fourth wall,the first batch load lock apparatus coupled to the first wall of themainframe body, a first carousel of the one or more carousels coupled tothe third wall of the mainframe body opposite the first batch load lock,the second batch load lock apparatus coupled to the second wall of themainframe body, and a second carousel of the one or more carouselscoupled to the fourth wall of the mainframe body opposite the secondbatch load lock.
 17. The wafer processing system of claim 16, whereinthe robot is configured to exchange wafers between the first batch loadlock apparatus and the first carousel while the second carousel isprocessing wafers.
 18. The wafer processing system of claim 16, whereinthe robot is configured to exchange wafers between the second batch loadlock apparatus and the second carousel while the first carousel isprocessing wafers.
 19. A wafer processing system, comprising: a transferchamber; one or more processing chambers coupled to the transferchamber; a batch load lock apparatus coupled to the transfer chamber,the batch load lock apparatus including multiple wafer stations andtemperature control capability; a robot within the transfer chamber andconfigured to transfer wafers between the one or more processingchambers and the batch load lock apparatus; and a mainframe bodyincluding a first wall, a second wall, a third wall, and a fourth wall,a first processing chamber of the one or more processing chamberscoupled to the first wall, a second processing chamber of the one ormore processing chambers coupled to the second wall, a third processingchamber of the one or more processing chambers coupled to the thirdwall, and the batch load lock apparatus coupled to the fourth wall. 20.The wafer processing system of claim 19, comprising the batch load lockapparatus and an additional batch load lock apparatus coupled to thefourth wall.